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  • AM-BP-005

    QFN/DFN Application Note

    QFN(Quad Flat No-lead)/DFN (Dual Flat No-lead) is a near CSP(Chip Size Package)plastic encapsulated package using conventional copper leadframe technology. The package structure conducts a cost-effective packaging solution that benefits to minimize package size as well as enhances thermal and electrical performance over the traditional leaded packages。 more